BMW BDC1 BDC2 BDC3 Immo & Gateway (ZGW) CPU 0N32E 0N61C BN78S Magnetic Stencil for BGA Reballing
BMW BDC1 BDC2 BDC3 Immo & Gateway (ZGW) CPU 0N32E 0N61C BN78S Magnetic Stencil for BGA Reballing
Import fees may apply. Ask our team for more info!
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My Supercar Expert now provides new stencil BGA reballing kits, which support
BDC1/BDC2 Immo Chip: SC667187MMJ (0N32E)
BDC1/BDC2 Gateway (ZGW) Chip: SPC5668EVMG (0N61C)
BDC3 Immo Chip: SC667469VMN6 (BN78S)
BDC3 Gateway (ZGW) Chip is not BGA so there is no stencil required.
The package includes:
- Magnetic base
- Stencil
- Lead-free Soldering paste (gift)
Instructions for use:
1. Remove all tin from the CPU
2. Set the CPU on the base and add the stencil on top
3. Use the soldering paste and make sure it is evenly distributed all around the stencil holes, removing any extras.
4. Using a heating gun, warm up the soldering paste until it starts to melt into the CPU pads
5. Let it cool down for several minutes, then remove the stencil and check if there is any missing pad. If not, you can start soldering the CPU on the PCB!
For more tips on the usage process, check our videos.
Before you order...
Before you order...
Check on the "Conditions" paragraph right above if any device is needed for coding or programming this product.
On your purchase, you will receive detailed instructions on how to install your new part.
Remember you can always contact us in advance for any info!
100% Tested
100% Tested
The product has been tested before shipping.
Shipping
Shipping
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