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BMW BDC1 BDC2 BDC3 Immo & Gateway (ZGW) CPU 0N32E 0N61C BN78S Magnetic Stencil for BGA Reballing

Descrizione

My Supercar Expert now provides new stencil BGA reballing kits, which support

BDC1/BDC2 Immo Chip: SC667187MMJ  (0N32E)

BDC1/BDC2 Gateway (ZGW) Chip: SPC5668EVMG  (0N61C)

BDC3 Immo Chip: SC667469VMN6  (BN78S)

BDC3 Gateway (ZGW) Chip is not BGA so there is no stencil required.

The package includes:
- Magnetic base
- Stencil
- Lead-free Soldering paste (gift)

Instructions for use:
1. Remove all tin from the CPU
2. Set the CPU on the base and add the stencil on top
3. Use the soldering paste and make sure it is evenly distributed all around the stencil holes, removing any extras.
4. Using a heating gun, warm up the soldering paste until it starts to melt into the CPU pads
5. Let it cool down for several minutes, then remove the stencil and check if there is any missing pad. If not, you can start soldering the CPU on the PCB!

For more tips on the usage process, check our videos.

Forma del prodotto

Next day shipping

$100.00

Import fees may apply. Ask our team for more info!

    • Guaranteed secure & safe checkout.

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      Before you order...

    Check on the "Conditions" paragraph right above if any device is needed for coding or programming this product.

    On your purchase, you will receive detailed instructions on how to install your new part.

    Remember you can always contact us in advance for any info!

      100% Tested

    The product has been tested before shipping.

    ShippingShipping

    We ship by DHL, FEDEX and UPS worldwide: for these couriers, delivery times are usually as it follows:
    Europe -> 5-7 days
    ASEAN and East Asia -> 1-3 days
    GCC and Oceania -> 3-6 days
    Rest of Asia -> 4-7 days
    Rest of the world -> 7-10 days

    For USA market please check here.

    Descrizione

    My Supercar Expert now provides new stencil BGA reballing kits, which support

    BDC1/BDC2 Immo Chip: SC667187MMJ  (0N32E)

    BDC1/BDC2 Gateway (ZGW) Chip: SPC5668EVMG  (0N61C)

    BDC3 Immo Chip: SC667469VMN6  (BN78S)

    BDC3 Gateway (ZGW) Chip is not BGA so there is no stencil required.

    The package includes:
    - Magnetic base
    - Stencil
    - Lead-free Soldering paste (gift)

    Instructions for use:
    1. Remove all tin from the CPU
    2. Set the CPU on the base and add the stencil on top
    3. Use the soldering paste and make sure it is evenly distributed all around the stencil holes, removing any extras.
    4. Using a heating gun, warm up the soldering paste until it starts to melt into the CPU pads
    5. Let it cool down for several minutes, then remove the stencil and check if there is any missing pad. If not, you can start soldering the CPU on the PCB!

    For more tips on the usage process, check our videos.

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