Infineon TC1793 TC1796 TC1797 TC298 / Freescale SPC5777 MPC5554 CPU Magnetic Stencil for BGA Reballing for EDC17 MEVD17 MD1 MG1 ECUs

Descrizione

This BGA stencil kit can be used to reball CPUs of the following series:
Freescale MPC5554 and Freescale SPC5777 + Infineon Tricore TC1796 / TC1797
Infineon Aurix TC298 and Tricore TC1793
These two groups are divided by the common adjustment plate, while the bottom base and the actual stencil are the same for all.

These chips are commonly used on MED17, EDC17, MD1, MG1 and other ECU series.

The package includes:
- Magnetic base
- Adjustment Plate * 2
- Stencil

Instructions for use:
1. Remove all tin from the CPU
2. Set the CPU on the base and add the stencil on top
3. Use soldering paste and make sure it is evenly distributed all around the stencil holes, removing any extras.
4. Using a heating gun, warm up the soldering paste until it starts to melt into the CPU pads
5. Let it cool down for several minutes, then remove the stencil and check if there is any missing pad. If not, you can start soldering the CPU on the PCB!

For more tips on the usage process, check our videos.

Forma del prodotto

Next day shipping

$150.00

Import fees may apply. Ask our team for more info!

  • Spedito oggi? Ordina entro: Feb 07, 2026 14:00:00 +0800

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      Before you order...

    Check on the "Conditions" paragraph right above if any device is needed for coding or programming this product.

    On your purchase, you will receive detailed instructions on how to install your new part.

    Remember you can always contact us in advance for any info!

      100% Tested

    The product has been tested before shipping.

    ShippingShipping

    We ship by DHL, FEDEX and UPS worldwide: for these couriers, delivery times are usually as it follows:
    Europe -> 5-7 days
    ASEAN and East Asia -> 1-3 days
    GCC and Oceania -> 3-6 days
    Rest of Asia -> 4-7 days
    Rest of the world -> 7-10 days

    For USA market please check here.

    Descrizione

    This BGA stencil kit can be used to reball CPUs of the following series:
    Freescale MPC5554 and Freescale SPC5777 + Infineon Tricore TC1796 / TC1797
    Infineon Aurix TC298 and Tricore TC1793
    These two groups are divided by the common adjustment plate, while the bottom base and the actual stencil are the same for all.

    These chips are commonly used on MED17, EDC17, MD1, MG1 and other ECU series.

    The package includes:
    - Magnetic base
    - Adjustment Plate * 2
    - Stencil

    Instructions for use:
    1. Remove all tin from the CPU
    2. Set the CPU on the base and add the stencil on top
    3. Use soldering paste and make sure it is evenly distributed all around the stencil holes, removing any extras.
    4. Using a heating gun, warm up the soldering paste until it starts to melt into the CPU pads
    5. Let it cool down for several minutes, then remove the stencil and check if there is any missing pad. If not, you can start soldering the CPU on the PCB!

    For more tips on the usage process, check our videos.

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